Display device

ABSTRACT

A display device including a display panel and a support layer is provided. The display panel has a light-transmitting area and a bonding area connected to the light-transmitting area. The support layer includes a first support layer and a second support layer, where the first support layer has a first portion corresponding to the light-transmitting area, the second support layer has a second portion corresponding to the bonding area, and an optical phase retardation coefficient of the first portion is less than an optical phase retardation coefficient of the second portion.

The present application claims priority of a Chinese patent applicationfiled with the National Intellectual Property Administration on Jan. 20,2021, application No. 202110072597.0, titled “Display device”, which isincorporated by reference in the present application in its entirety.

FIELD OF INVENTION

This application relates to the field of display technology, and inparticular to a display device.

BACKGROUND OF INVENTION

With changes in people's aesthetics and development of mobile terminalproducts, full-screen design is an inevitable trend in development ofterminal products. Based on a flexible OLED panel, a bonding area can bebent to a backside of a screen by using a pad bending technology toachieve a narrower bottom frame. Using under-screen optical orultrasonic fingerprint technology, screen sound technology, andunder-screen camera technology, a sensor can be placed under the screento further increase a screen-to-body ratio.

There are two ways to realize a camera-under-screen solution, which areblind hole solution and through-hole solution. Compared with athrough-hole screen, a blind-hole screen can hide a camera under ascreen, and the screen can display normally. This design is beneficialto increase a screen-to-body ratio and thus has a broader marketprospect. In the blind-hole screen, a support layer and a heatdissipation layer are disposed under a display panel. The support layerhas functions of supporting and protecting the display panel, andbecause the support layer in the bonding area has a small thermalexpansion, during a die bonding process, bonding failure caused by avolume change of the support layer will not occur. The heat dissipationlayer is used for heat dissipation, and it is usually an opaque layer.In order to meet lighting requirements of the camera, a drilling processwill be performed on the heat dissipation layer. The support layeritself has a certain degree of light transmittance, so there are usuallytwo treatment ways for the support layer: one is to retain an entireportion of the support layer; in this way, support and protection effectof the support layer on the display panel in a blind hole area and thebonding area can be maintained. However, light will cause seriousinterference after passing through the support layer, forming bright anddark stripes, which further affects lighting of the camera. The other isto perform a drilling process on the blind hole area of the supportlayer to prevent the influence of light on the support layer. However,this solution will cause the display panel in the blind hole area tolack protection and support, and compression resistance of the displaypanel will not meet demand.

Technical Problem

The support layer of the current display device will cause the light toform bright and dark stripes, which will affect the lighting effect ofthe camera. However, if a drilling process is performed on the supportlayer, the compression resistance of the display panel in the blind holearea will be insufficient.

SUMMARY OF INVENTION

The present application provides a display device for solving the abovetechnical problems.

The present application provides a display device, which includes: adisplay panel including a light-transmitting area and a bonding areaconnected to the light-transmitting area; a support layer disposed on abackside of the display panel, wherein the support layer includes afirst support layer and a second support layer, the first support layerincludes a first portion corresponding to the light-transmitting area,the second support layer includes a second portion corresponding to thebonding area, and an optical phase retardation coefficient of the firstportion is less than an optical phase retardation coefficient of thesecond portion.

In the display device of the present application, a thermal expansioncoefficient of the second portion is less than a thermal expansioncoefficient of the first portion.

In the display device of the present application, the optical phaseretardation coefficient of the first portion is less than or equal to100.

In the display device of the present application, material of the firstportion includes at least one of cycloolefin polymer, triacetylcellulose, colorless polyimide, or poly (methyl methacrylate).

In the display device of the present application, the material of thesecond portion includes polyethylene terephthalate.

In the display device of the present application, the display panelincludes a first area, the first area includes the light-transmittingarea, and the bonding area is connected to the first area.

In the display device of the present application, the first supportlayer is disposed corresponding to the first area, and the first portionis an entire region of the first support layer.

In the display device of the present application, an area of the firstportion is greater than an area of the light-transmitting area.

In the display device of the present application, the second portion isan entire region of the second support layer.

In the display device of the present application, the display panelfurther includes a bending area connected between the first area and thebonding area, and the first area is disposed opposite to the bondingarea.

In the display device of the present application, the support layerfurther includes a third support layer disposed corresponding to thefirst area, the third support layer is provided with a first opening,and the first support layer is disposed in the first opening.

In the display device of the present application, the material of thesecond support layer and the material of the third support layer bothinclude polyethylene terephthalate.

In the display device of the present application, the support layerfurther includes a third support layer disposed corresponding to thefirst area, the third support layer is located on a lower side of thefirst support layer, the third support layer is provided with a secondopening, and the second opening is provided corresponding to theposition of the light-transmitting area.

In the display device of the present application, the first supportlayer is disposed corresponding to the first area, and the secondsupport layer is disposed corresponding to the bonding area.

In the display device of the present application, the first supportlayer is disposed corresponding to the first area and the bonding area,the second support layer is disposed corresponding to the bonding area,and the second support layer is located on a side of the first supportlayer away from the display panel.

In the display device of the present application, the display devicefurther includes an anti-reflective film on one side of the supportlayer, wherein the anti-reflective film is disposed corresponding to thelight-transmitting area.

In the display device of the present application, the material of theanti-reflective film includes a submicron-level transparent ceramicmaterial.

In the display device of the present application, the display devicefurther includes a polarizing layer disposed on the display panel, acover plate layer disposed on the polarizing layer, and a heatdissipation layer disposed on a backside of the support layer, whereinthe heat dissipation layer is provided with a third openingcorresponding to the light-transmitting area.

In the display device of the present application, the display devicefurther includes an optical component, and the optical component isdisposed corresponding to the light-transmitting area.

The application further provides a display device, which includes: adisplay panel including a first area, a bending area connected to thefirst area, and a bonding area connected to the bending area, whereinthe first area includes a light-transmitting area; a support layerdisposed on a backside of the display panel, wherein the support layerincludes a first support layer, a second support layer, and a thirdsupport layer, the first support layer is disposed corresponding to thefirst area and the bonding area, the second support layer is disposedcorresponding to the bonding area, and the second support layer islocated on a side of the first support layer away from the displaypanel, the third support layer is disposed corresponding to the firstarea, and the third support layer is located on a side of the firstsupport layer away from the display panel, the third support layer isprovided with an opening corresponding to a position of thelight-transmitting area, and an optical phase retardation coefficient ofthe first support layer is less than an optical phase retardationcoefficient of the second support layer.

In the display device provided in the present application, byconfiguring a light phase retardation coefficient of the first portionof the support layer corresponding to the light-transmitting area of thedisplay panel to be less than a light phase retardation coefficient ofthe second portion of the support layer, the phase retardation effect ofthe support layer on the light passing through the light-transmittingarea is alleviated or eliminated, which prevents light and dark stripesfrom appearing in the light-transmitting area, and improves the lightingeffect of optical components under the screen. Further, compared with adesign of drilling the support layer in the light-transmitting area, thepresent application can improve the compression resistance of thedisplay panel. In addition, the support layer corresponding to thebonding area of the display panel has a smaller thermal expansioncoefficient, which prevents a bonding failure due to an excessiveexpansion and contraction of the support layer during a bonding process,and improves the manufacturing yield and the reliability of the displaydevice.

DESCRIPTION OF DRAWINGS

In order to more clearly illustrate the technical solutions in theembodiments of the present invention, the following figures described inthe embodiments will be briefly introduced. It is obvious that thedrawings described below are merely some embodiments of the presentinvention, other drawings can also be obtained by the person ordinaryskilled in the field based on these drawings without doing any creativeactivity.

FIG. 1 is a schematic diagram of a first structure of a display deviceprovided by an embodiment of the present application.

FIG. 2 is a schematic diagram of the structure of the display deviceshown in FIG. 1 with an anti-reflective film added.

FIG. 3 is a schematic diagram of a second structure of a display deviceprovided by an embodiment of the present application.

FIG. 4 is a schematic diagram of a structure of a support layer in thedisplay device shown in FIG. 3 during a manufacturing process.

FIG. 5 is a schematic diagram of a third structure of a display deviceprovided by an embodiment of the present application.

FIG. 6 is a schematic diagram of a structure of a support layer in thedisplay device shown in FIG. 5 during a manufacturing process.

FIG. 7 is a schematic diagram of a fourth structure of a display deviceprovided by an embodiment of the present application.

FIG. 8 is a schematic diagram of a structure of a support layer in thedisplay device shown in FIG. 7 during a manufacturing process.

FIG. 9 is a schematic diagram of a fifth structure of a display deviceprovided by an embodiment of the present application.

FIG. 10 is a schematic diagram of a structure of a support layer in thedisplay device shown in FIG. 9 during a manufacturing process.

FIG. 11 is a schematic diagram of a sixth structure of a display deviceprovided by an embodiment of the present application.

FIG. 12 is a schematic diagram of a structure of a display device shownin FIG. 1 added with an optical component.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The technical solutions in the embodiments of the present applicationwill be clearly and completely described below with reference to thedrawings in the embodiments of the present application. Obviously, theembodiments are only a part of the embodiments of the presentapplication, rather than all the embodiments. Based on the embodimentsin this application, all other embodiments obtained by those skilled inthe art without creative work shall fall within the protection scope ofthis application.

An embodiment of the present application provides a display deviceincluding a display panel and a support layer for supporting the displaypanel. The display panel has a light-transmitting area and a bondingarea connected to the light-transmitting area. The support layerincludes a first support layer and a second support layer, where thefirst support layer has a first portion corresponding to thelight-transmitting area, the second support layer has a second portioncorresponding to the bonding area, and an optical phase retardationcoefficient of the first portion is less than an optical phaseretardation coefficient of the second portion. In the embodiments of thepresent application, the light phase retardation coefficient of thesupport layer corresponding to the light-transmitting area of thedisplay panel is reduced, so as to alleviate or eliminate the phaseretardation effect of the support layer on the light in thelight-transmitting area. It prevents the light and dark stripes fromappearing in the light-transmitting area, so as to improve the lightingeffect of optical components under the screen. In addition, the supportlayer corresponding to the bonding area of the display panel has asmaller thermal expansion coefficient, which prevents a bonding failuredue to an excessive expansion and contraction of the support layerduring a bonding process.

Please refer to FIG. 1 , which is a schematic diagram of a firststructure of a display device provided by an embodiment of the presentapplication. The display device includes a display panel 10, a supportlayer 20 disposed on a backside of the display panel 10, a polarizerlayer 30 disposed on the display panel 10, a cover plate layer 40disposed on the polarizer layer 30, and a heat dissipation layer 50disposed on a lower side of the support layer 20. Wherein, the displaypanel 10 may be an organic light-emitting diode display panel, and thedisplay panel 10 may have flexibility in at least a partial area thereofand can be bent to a backside of the partial area of the display panel10. The support layer 20 is used to support and protect the displaypanel 10 to ensure that the display panel 10 maintains a normal workingshape under external pressure or heat. The polarizer layer 30 has apolarization effect and is used to adjust the visual effect of thedisplay panel 10, and the polarizer layer 30 may be a monolithicpolarizer. The cover plate layer 40 is used to encapsulate and protectvarious components in the display device to prevent damage from externalforces or corrosion by external water vapor, etc., and the cover platelayer 40 may be a glass cover plate. The heat dissipation layer 50 isused to conduct and dissipate the heat in the display device. Itprevents heat accumulation from damaging the display device. The heatdissipation layer 50 may be a composite film layer composed of acomposite adhesive layer, a metal copper layer, a polyimide layer, and afoam layer.

The display panel 10 includes a light-transmitting area 101 and abonding area 102 connected to the light-transmitting area 101. It shouldbe noted that display panel 10 is the main body of the display devicethat performs a display function, and a plurality of pixel units areprovided inside. The light-transmitting area 101 has higher lighttransmittance than other areas of the display panel 10, so as to meetthe lighting requirements of the optical components disposed on thelower side of the light-transmitting area 101. In order to achieve thehigh light transmittance of the light-transmitting area 101, thearrangement density of the pixel units in the light-transmitting area101 is less than the arrangement density of the pixel units in otherareas of the display panel 10 to ensure that light passes through thelight-transmitting area 101 smoothly. The bonding area 102 may not havea display function, and a variety of wiring lines are provided inside.The chip IC or flexible circuit board is bonded to the display panel 10through the bonding area 102, used to provide a driving signal or acontrol signal for the display panel 10. The method of bonding the chipIC or flexible circuit board to the display panel 10 is the hot-pressingmethod. Because the hot-pressing method needs to heat the bonding area102, other functional layers corresponding to the bonding area 102 needto have certain heat resistance, especially the thermal expansioncoefficient must be able to meet the requirements of hot pressing. Thebonding area 102 may be bent to a backside of the display panel 10through a bending area to realize the narrow frame design of the displaydevice. The heat dissipation layer 50 includes a third openingcorresponding to the light-transmitting area 101.

The support layer 20 is disposed on the backside of the display panel 10or an opposite side of the light-emitting surface of the display panel10. The support layer 20 includes a first support layer 21 and a secondsupport layer 22. The first support layer 21 includes a first portion211 corresponding to the light-transmitting area 101, and the secondsupport layer 22 includes a second portion corresponding to the bondingarea 102, and the second portion may be part or all of the secondsupport layer 22. Wherein, an optical phase delay coefficient of thefirst portion 211 is less than an optical phase delay coefficient of thesecond portion.

It should be noted that the support layer 20 has light transmittance inat least an area corresponding to the first portion 211. When lightpasses through the intermediate medium, because the intermediate mediumhas a phase retardation effect on the light, its phase will change tovarying degrees. The greater the phase difference, the greater the lightinterference effect between the lights, and the bright and dark fringesformed by the emitted light are more serious. In the embodiment of thepresent application, the first portion 211 is equivalent to theintermediate medium. By adjusting the optical phase delay coefficient ofthe first portion 211, the optical phase delay coefficient of the firstportion 211 is less than that of the second portion, or the opticalphase retardation coefficient of the first portion 211 is less than theoptical phase retardation coefficient of other areas of the supportlayer 20 except for the first portion 211. Therefore, the light and darkfringes generated by the phase retardation of the support layer on thelight are reduced or eliminated, which is beneficial to improve thelighting effect of the optical components disposed corresponding to thelight-transmitting area 101.

Alternatively, an optical phase retardation coefficient of the firstportion 211 is less than or equal to 100, and an optical phaseretardation coefficient of the second portion is greater than 100. Itshould be noted that through multiple creative experiments and creativecalculations on the basis of the experiments, it is proven that when thelight phase retardation coefficient of the first portion 211 is lessthan or equal to 100, the phase retardation effect on the light will notcause the emitted light to form bright and dark stripes, or have asignificant impact on the lighting effect of the optical componentsunder the screen.

Alternatively, the first portion 211 may be made of materials with a lowphase retardation coefficient such as cyclic olefin polymer (COP),tri-cellulose acetate (TAC), colorless polyimide (CPI), or poly (methylmethacrylate) (PMMA).

Alternatively, please refer to FIG. 2 . The display device furtherincludes an anti-reflective film AR on one side of the support layer 20,and the anti-reflective film AR is disposed corresponding to thelight-transmitting area 101 to increase the light transmittance of thedisplay device at the light-transmitting area 101. The anti-reflectivefilm AR can be made of sub-micron-level transparent ceramic materials.

Further, the thermal expansion coefficient of the second portion is lessthan the thermal expansion coefficient of the first portion 211. Itshould be noted that the second portion of the second support layer 22corresponds to the bonding area 102 of the display panel 10, and becausethe process of bonding the chip IC or flexible circuit board to thebonding area 102 requires adopting a hot-pressing method, the supportlayer that supports the bonding area 102 needs to have good heatresistance. The thermal expansion coefficient of a material is anindicator that reflects the expansion and contraction performance of thematerial when it is heated. In this embodiment, the thermal expansioncoefficient of the second portion is adjusted so that the thermalexpansion coefficient of the second portion is less than the thermalexpansion coefficient of the first portion 211, or the thermal expansioncoefficient of the second portion is less than the thermal expansioncoefficient of other areas of the support layer 20 except for the secondportion. Therefore, the display panel 10 not properly bonding to thechip IC or the flexible circuit board due to excessive thermal expansionof the support layer is prevented, which is beneficial to improve themanufacturing yield and reliability of the display device.

Alternatively, the second portion may be made of materials with arelatively low thermal expansion coefficient such as polyethyleneterephthalate (PET).

It should be noted that the first portion 211 may not only correspond tothe light-transmitting area 101 of the display panel 10, it can also becorrespondingly disposed on the backside of other areas of the displaypanel 10 except for the bonding area 102. The second portion may notonly correspond to the bonding area 102 of the display panel 10, but mayalso be correspondingly disposed on the backside of other areas of thedisplay panel 10 except the light-transmitting area 101.

In one embodiment, please refer to FIG. 3 . FIG. 3 is a schematicdiagram of a second structure of a display device provided in anembodiment of the present application. The display device includes adisplay panel 10, a support layer 20 disposed on the backside of thedisplay panel 10, a polarizer layer 30 disposed on the display panel 10,a cover plate layer 40 disposed on the polarizer layer 30, and a heatdissipation layer 50 disposed on a lower side of the support layer 20.Wherein, the display panel 10 may be an organic light-emitting diodedisplay panel. The display panel 10 may have flexibility in at least apartial area and can be bent to the backside of the partial area of thedisplay panel 10. The support layer 20 is used to support and protectthe display panel 10 to ensure that the display panel 10 maintains anormal working shape under external pressure or heat. The polarizerlayer 30 has a polarization effect and is used to adjust the visualeffect of the display panel 10, and the polarizer layer 30 may be amonolithic polarizer. The cover plate layer 40 is used to encapsulateand protect various components in the display device to prevent damagefrom external forces or corrosion by external water vapor, etc., and thecover plate layer 40 may be a glass cover plate. The heat dissipationlayer 50 is used to conduct and dissipate the heat in the displaydevice. It prevents heat accumulation from damaging the display device.The heat dissipation layer 50 may be a composite film layer composed ofa composite adhesive layer, a metal copper layer, a polyimide layer, anda foam layer.

The display panel 10 includes a first area 110 and a bonding area 102connected to the first area 110, and the first area 110 includes alight-transmitting area 101. The first area 110 may be an area with adisplay function in the display panel 10. Compared with other areas onthe display panel 10, the light-transmitting area 101 has higher lighttransmittance to meet the lighting requirements of the opticalcomponents disposed on the lower side of the light-transmitting area101. The bonding area 102 may not have a display function, and a varietyof wiring lines are provided inside. The chip IC or flexible circuitboard is bonded to the display panel 10 through the bonding area 102,used to provide a driving signal or a control signal for the displaypanel 10. The method of bonding the chip IC or flexible circuit board tothe display panel 10 is the hot-pressing method. The bonding area 102may be bent to a backside of the display panel 10 through a bending areato realize the narrow frame design of the display device. The heatdissipation layer 50 includes a third opening corresponding to thelight-transmitting area 101.

The support layer 20 is disposed on the backside of the display panel oran opposite side of the light-emitting surface of the display panel 10.The support layer 20 includes a first support layer 21 and a secondsupport layer 22. The first support layer 21 is disposed correspondingto the first area 110. The first support layer 21 is disposed on thelower side of the light-transmitting area 101. The second support layer22 is disposed corresponding to the bonding area 102. Wherein, anoptical phase retardation coefficient of the first support layer 21 isless than an optical phase retardation coefficient of the second supportlayer 22.

It should be noted that the first support layer 21 has lighttransmittance in at least an area corresponding to thelight-transmitting area 101. In this embodiment, by adjusting theoptical phase retardation coefficient of the first support layer 21, theoptical phase retardation coefficient of the first support layer 21 ismade less than the optical phase retardation coefficient of the secondsupport layer 22. Therefore, the phase retardation effect of the firstsupport layer 21 on the light is reduced or eliminated. In addition, thelight passing through the light-transmitting area 101 is prevented fromforming bright and dark stripes, which is beneficial to improve thelighting effect of the optical components disposed corresponding to thelight-transmitting area 101.

Alternatively, an optical phase retardation coefficient of the firstsupport layer 21 is less than or equal to 100, and an optical phaseretardation coefficient of the second support layer 22 is greater than100. It should be noted that through multiple creative experiments andcreative calculations on the basis of the experiments, it is proven thatwhen the light phase retardation coefficient of the first support layer21 is set to be less than or equal to 100, the phase retardation effecton the light will not cause the emitted light to form bright and darkstripes, or have a significant impact on the lighting effect of theoptical components under the screen.

Alternatively, the first support layer 21 may be made of materials witha low phase retardation coefficient such as cyclic olefin polymer (COP),tri-cellulose acetate (TAC), colorless polyimide (CPI), or poly (methylmethacrylate) (PMMA).

Further, the thermal expansion coefficient of the second support layer22 is less than the thermal expansion coefficient of the first supportlayer 21. It should be noted that the second support layer 22corresponds to the bonding area 102 of the display panel 10, and becausethe process of bonding the chip IC or flexible circuit board to thebonding area 102 requires adopting a hot-pressing method, the supportlayer that supports the bonding area 102 needs to have good heatresistance. In this embodiment, the thermal expansion coefficient of thesecond support layer 22 is adjusted so that the thermal expansioncoefficient of the support layer 22 is less than the thermal expansioncoefficient of the first support layer 21. By controlling the expansionamount of the second support layer 22 under the condition of hotpressing, it prevents the chip IC or flexible circuit board from beingpoorly bonded to the display panel 10 due to excessive expansion of thesupport layer. It is beneficial to improve the manufacturing yield andreliability of the display device.

Alternatively, the second support layer 22 may be made of materials witha relatively low thermal expansion coefficient such as polyethyleneterephthalate (PET).

Further, please refer to FIG. 3 and FIG. 4 . FIG. 4 is a schematicdiagram of a structure of the support layer in the display device shownin FIG. 3 during the manufacturing process. Before the support layer 20is attached to the display panel 10, a release film C1 and a carrierfilm C2 are attached to both sides of the support layer 20,respectively. In this embodiment, the method of manufacturing thesupport layer 20 includes following steps: taking a first raw materialincluding a first splicing layer L1 and a second raw material includinga second splicing layer L2, wherein the first splicing layer L1corresponds to the first support layer 21, and the second splicing layerL2 corresponds to the second support layer 22; removing the release filmC1 and the carrier film C2 attached on both sides of the first rawmaterial and the second raw material to obtain the first splicing layerL1 and the second splicing layer L2; attaching the first splicing layerL1 and the second splicing layer L2 side by side between the new carrierfilm C2 and the release film C1; using a die-cut mold to perform ahalf-cutting process along a cutting line B1 of the carrier film C2 sideuntil reaching a bonding surface of the release film C1 and the firstsplicing layer L1 or the second splicing layer L2, wherein the cuttingarea enclosed by the cutting line B1 includes a connecting seam betweenthe first splicing layer L1 and the second splicing layer L2; removingthe cut carrier film C2, and attaching the complete carrier film C2thereto; removing the release film C1, and respectively attaching thefirst splicing layer L1 and the second splicing layer L2 theretocorresponding to the first area 110 and the bonding area 102 of thedisplay panel 10; removing the carrier film C2, and the manufacturing ofthe support layer 20 is completed.

In one embodiment, please refer to FIG. 5 . FIG. 5 is a schematicdiagram of a third structure of a display device provided in anembodiment of the present application. The display device includes adisplay panel 10, a support layer 20 disposed on a backside of thedisplay panel 10, a polarizer layer 30 disposed on the display panel 10,a cover plate layer 40 disposed on the polarizer layer 30, and a heatdissipation layer 50 disposed on a lower side of the support layer 20.Wherein, the display panel 10 may be an organic light-emitting diodedisplay panel, and the display panel 10 may have flexibility in at leasta partial area thereof and can be bent to a backside of the partial areaof the display panel. The support layer 20 is used to support andprotect the display panel 10 to ensure that the display panel 10maintains a normal working shape under external pressure or heat. Thepolarizer layer 30 has a polarization effect and is used to adjust thevisual effect of the display panel 10, and the polarizer layer 30 may bea monolithic polarizer. The cover plate layer 40 is used to encapsulateand protect various components in the display device to prevent damagefrom external forces or corrosion by external water vapor, etc., and thecover plate layer 40 may be a glass cover plate. The heat dissipationlayer 50 is used to conduct and dissipate the heat in the displaydevice. It prevents heat accumulation from damaging the display device.The heat dissipation layer 50 can be a composite film layer composed ofa composite adhesive layer, a metal copper layer, a polyimide layer, anda foam layer.

The display panel 10 includes a first area 110 and a bonding area 102connected to the first area 110, and the first area 110 includes alight-transmitting area 101. The first area 110 may be an area with adisplay function in the display panel 10. Compared with other areas onthe display panel 10, the light-transmitting area 101 has higher lighttransmittance to meet the lighting requirements of the opticalcomponents disposed on the lower side of the light-transmitting area101. The bonding area 102 may not have a display function, and a varietyof wiring lines are provided inside. The chip IC or flexible circuitboard is bonded to the display panel 10 through the bonding area 102 andis used to provide driving or control signals for the display panel 10.The method of bonding the chip IC or the flexible circuit board and thedisplay panel 10 may be a hot-pressing method. The bonding area 102 canbe bent to the backside of the display panel 10 through a bending areato realize the narrow frame design of the display device. The heatdissipation layer 50 includes a third opening corresponding to thelight-transmitting area 101.

The support layer 20 is disposed on the backside of the display panel 10or an opposite side of the light-emitting surface of the display panel10. The support layer 20 includes a first support layer 21, a secondsupport layer 22, and a third support layer 23. At least a part of thearea of the first support layer 21 is disposed corresponding to thelight-transmitting area 101. The second support layer 22 is disposedcorresponding to the bonding area 102, and the third support layer 23 isdisposed corresponding to the first area 110. The third support layer 23is provided with a first opening, and the first support layer 21 isdisposed in the first opening. Wherein, an optical phase delaycoefficient of the first support layer 21 is less than an optical phasedelay coefficient of the second support layer 22.

It should be noted that the first support layer 21 has lighttransmittance in at least an area corresponding to thelight-transmitting area 101. In this embodiment, by adjusting theoptical phase delay coefficient of the first support layer 21, theoptical phase delay coefficient of the first support layer 21 is lessthan that of the second support layer 22, so as to reduce or eliminatethe phase retardation effect of the first support layer 21 on the light.It prevents the light passing through the light-transmitting area 101from forming bright and dark stripes, and it is beneficial to improvethe lighting effect of the optical components disposed corresponding tothe light-transmitting area 101.

Alternatively, an optical phase retardation coefficient of the firstsupport layer 21 is less than or equal to 100, and an optical phaseretardation coefficient of the second support layer 22 is greater than100. It should be noted that through multiple creative experiments andcreative calculations on the basis of the experiments, it is proven thatwhen the light phase retardation coefficient of the first support layer21 is set to be less than or equal to 100, the phase retardation effecton the light will not cause the emitted light to form bright and darkstripes, or have a significant impact on the lighting effect of theoptical components under the screen.

Alternatively, the first support layer 21 may be made of materials witha low phase retardation coefficient such as cyclic olefin polymer (COP),tri-cellulose acetate (TAC), colorless polyimide (CPI), or poly (methylmethacrylate) (PMMA).

Further, the thermal expansion coefficient of the second support layer22 is less than the thermal expansion coefficient of the first supportlayer 21. It should be noted that the second support layer 22corresponds to the bonding area 102 of the display panel 10, and becausethe process of bonding the chip IC or flexible circuit board to thebonding area 102 requires adopting a hot-pressing method, the supportlayer that supports the bonding area 102 needs to have good heatresistance. In this embodiment, the thermal expansion coefficient of thesecond support layer 22 is adjusted so that the thermal expansioncoefficient of the support layer 22 is less than the thermal expansioncoefficient of the first support layer 21. By controlling the expansionamount of the second support layer 22 under the condition of hotpressing, it prevents the chip IC or flexible circuit board from beingpoorly bonded to the display panel 10 due to excessive expansion of thesupport layer. It is beneficial to improve the manufacturing yield andreliability of the display device.

Alternatively, the second support layer 22 and the third support layer23 may be made of materials with a relatively low thermal expansioncoefficient such as polyethylene terephthalate (PET).

Further, please refer to FIG. 5 and FIG. 6 . FIG. 6 is a schematicdiagram of a structure of the support layer in the display device shownin FIG. 5 during the manufacturing process. Before the support layer 20is attached to the display panel 10, a release film C1 and a carrierfilm C2 are attached to both sides of the support layer 20,respectively. In this embodiment, the method of manufacturing thesupport layer 20 includes following steps: taking a first raw materialincluding a first splicing layer L1, a second raw material including asecond splicing layer L2, and a third raw material including a thirdsplicing layer L3, wherein the first splicing layer L1 corresponds tothe first support layer 21, a partial area of the second splicing layerL2 corresponds to the second support layer 22, and a remaining area ofthe second splicing layer L2 and the third splicing layer L3 correspondto the third support layer 23; cutting the first raw material, thesecond raw material, and the third raw material according to the sizecorresponding to the support layer 20 shown in FIG. 5 ; removing therelease film C1 and the carrier film C2 attached on both sides of thefirst raw material, the second raw material, and the third raw materialto obtain the first splicing layer L1, the second splicing layer L2, andthe third splicing layer L3; attaching the third splicing layer L3, thefirst splicing layer L1, and the second splicing layer L2 side by sidebetween the new carrier film C2 and the release film C1 in sequence;using a die-cut mold to perform a half-cutting process along a cuttingline B1 of the carrier film C2 side until reaching a bonding surface ofthe release film C1 and the second splicing layer L2; removing the cutcarrier film C2, and attaching the complete carrier film C2 is attachedthereto; removing the release film C1, and attaching the third splicinglayer L3, the first splicing layer L1, and the second splicing layer L2integrally to the backside of the display panel 10 according to thepositions shown in the embodiment of FIG. 5 ; removing the carrier filmC2, and the manufacturing of the support layer 20 is completed.

In one embodiment, please refer to FIG. 7 . FIG. 7 is a schematicdiagram of a fourth structure of a display device provided by anembodiment of the present application. The display device includes adisplay panel 10, a support layer 20 disposed on the backside of thedisplay panel 10, a polarizer layer 30 disposed on the display panel 10,a cover plate layer 40 disposed on the polarizer layer 30, and a heatdissipation layer 50 disposed on the lower side of the support layer 20.Wherein, the display panel 10 may be an organic light-emitting diodedisplay panel, the display panel 10 may have flexibility in at least apartial area thereof, and can be bent to the backside of the partialarea of the display panel 10. The support layer 20 is used to supportand protect the display panel 10 to ensure that the display panel 10maintains a normal working shape under external pressure or heat. Thepolarizer layer 30 has a polarization effect and is used to adjust thevisual effect of the display panel 10, and the polarizer layer 30 may bea monolithic polarizer. The cover plate layer 40 is used to encapsulateand protect various components in the display device to prevent damagefrom external forces or corrosion by external water vapor, etc., and thecover plate layer 40 may be a glass cover plate. The heat dissipationlayer 50 is used to conduct and dissipate the heat in the displaydevice. It prevents heat accumulation from damaging the display device.The heat dissipation layer 50 can be a composite film layer composed ofa composite adhesive layer, a metal copper layer, a polyimide layer, anda foam layer.

The display panel 10 includes a first area 110 and a bonding area 102connected to the first area 110, and the first area 110 includes alight-transmitting area 101. The first area 110 may be an area with adisplay function in the display panel 10. Compared with other areas onthe display panel 10, the light-transmitting area 101 has higher lighttransmittance to meet the lighting requirements of the opticalcomponents disposed on the lower side of the light-transmitting area101. The bonding area 102 may not have a display function, and a varietyof wiring lines are provided inside. The chip IC or flexible circuitboard is bonded to the display panel 10 through the bonding area 102,used to provide a driving signal or a control signal for the displaypanel 10. The method of bonding the chip IC or flexible circuit board tothe display panel 10 is the hot-pressing method. The bonding area 102can be bent to a backside of the display panel 10 through a bending areato realize the narrow frame design of the display device. The heatdissipation layer 50 includes a third opening corresponding to thelight-transmitting area 101.

The support layer 20 is disposed on the backside of the display panel oran opposite side of the light-emitting surface of the display panel 10.The support layer 20 includes a first support layer 21, a second supportlayer 22, and a third support layer 23. The third support layer 23 isside by side with the first support layer 21, and the third supportlayer 23 is disposed between the first support layer 21 and the secondsupport layer 22, or the first support layer 21 is disposed between thethird support layer 23 and the second support layer 22. The firstsupport layer 21 and the third support layer 23 are disposedcorresponding to the first area, a partial area of the first supportlayer 21 corresponds to the light-transmitting area 101, and the secondsupport layer 22 is disposed corresponding to the bonding area 102. Theratio of an area of the first support layer 21 to an area of the thirdsupport layer 23 is adjustable, and it is only necessary to ensure thatthe light-transmitting area 101 corresponds to the first support layer21. Wherein, an optical phase delay coefficient of the first supportlayer 21 is less than an optical phase delay coefficient of the secondsupport layer 22.

It should be noted that the first support layer 21 has lighttransmittance in at least an area corresponding to thelight-transmitting area 101. In this embodiment, by adjusting theoptical phase delay coefficient of the first support layer 21, theoptical phase delay coefficient of the first support layer 21 is lessthan that of the second support layer 22, so as to reduce or eliminatethe phase retardation effect of the first support layer 21 on the light.It prevents the light passing through the light-transmitting area 101from forming bright and dark stripes. It is beneficial to improve thelighting effect of the optical components disposed corresponding to thelight-transmitting area 101.

Alternatively, an optical phase retardation coefficient of the firstsupport layer 21 is less than or equal to 100, and an optical phaseretardation coefficient of the second support layer 22 is greater than100. It should be noted that through multiple creative experiments andcreative calculations on the basis of the experiments, it is proven thatwhen the light phase retardation coefficient of the first support layer21 is set to be less than or equal to 100, the phase retardation effecton the light will not cause the emitted light to form bright and darkstripes, or have a significant impact on the lighting effect of theoptical components under the screen.

Alternatively, the first support layer 21 may be made of materials witha low phase retardation coefficient such as cyclic olefin polymer (COP),tri-cellulose acetate (TAC), colorless polyimide (CPI), or poly (methylmethacrylate) (PMMA).

Further, the thermal expansion coefficient of the second support layer22 is less than the thermal expansion coefficient of the first supportlayer 21. It should be noted that the second support layer 22corresponds to the bonding area 102 of the display panel 10, and becausethe process of bonding the chip IC or flexible circuit board to thebonding area 102 requires adopting a hot-pressing method, the supportlayer that supports the bonding area 102 needs to have good heatresistance. In this embodiment, the thermal expansion coefficient of thesecond support layer 22 is adjusted so that the thermal expansioncoefficient of the support layer 22 is less than the thermal expansioncoefficient of the first support layer 21. By controlling the expansionamount of the second support layer 22 under the condition of hotpressing, it prevents the chip IC or flexible circuit board from beingpoorly bonded to the display panel 10 due to excessive expansion of thesupport layer. It is beneficial to improve the manufacturing yield andreliability of the display device.

Alternatively, the second support layer 22 and the third support layer23 may be made of materials with a low phase retardation coefficientsuch as polyethylene terephthalate (PET).

Further, please refer to FIG. 7 and FIG. 8 . FIG. 8 is a schematicdiagram of a structure of the support layer in the display device shownin FIG. 7 during the manufacturing process. Before the support layer 20is attached to the display panel 10, a release film C1 and a carrierfilm C2 are attached to both sides of the support layer 20,respectively.

In this embodiment, the method of manufacturing the support layer 20includes following steps: taking a first raw material including a firstsplicing layer L1 and a second raw material including a second splicinglayer L2, wherein the first splicing layer L1 corresponds to the firstsupport layer 21, and parts of the areas of the second splicing layer L2corresponds to the second support layer 22 and the third support layer23, respectively; removing the release film C1 and the carrier film C2attached on both sides of the first raw material and the second rawmaterial to obtain the first splicing layer L1 and the second splicinglayer L2; attaching the first splicing layer L1 and the second splicinglayer L2 side by side between the new carrier film C2 and the releasefilm C1; using a die-cut mold to perform a half-cutting process along acutting line B1 of the carrier film C2 side until reaching a bondingsurface of the release film C1 and the second splicing layer L2;removing the cut carrier film C2, and attaching the complete carrierfilm C2 thereto; removing the release film C1, and attaching the firstsplicing layer L1 and the second splicing layer L2 to the backside ofthe display panel 10 as a whole according to the positions shown in theembodiment of FIG. 7 ; removing the carrier film C2, and themanufacturing of the support layer 20 is completed.

In one embodiment, please refer to FIG. 9 . FIG. 9 is a schematicdiagram of a fifth structure of a display device provided by anembodiment of the present application. The display device includes adisplay panel 10, a support layer 20 disposed on the backside of thedisplay panel 10, a polarizer layer 30 disposed on the display panel 10,a cover plate layer 40 disposed on the polarizer layer 30, and a heatdissipation layer 50 disposed on the lower side of the support layer 20.Wherein, the display panel 10 may be an organic light-emitting diodedisplay panel, the display panel 10 may have flexibility in at least apartial area thereof, and can be bent to the backside of the partialarea of the display panel. The support layer 20 is used to support andprotect the display panel 10 to ensure that the display panel 10maintains a normal working shape under external pressure or heat. Thepolarizer layer 30 has a polarization effect and is used to adjust thevisual effect of the display panel 10, and the polarizer layer 30 may bea monolithic polarizer. The cover plate layer 40 is used to encapsulateand protect various components in the display device to prevent damagefrom external forces or corrosion by external water vapor, etc., and thecover plate layer 40 may be a glass cover plate. The heat dissipationlayer 50 is used to conduct and dissipate the heat in the displaydevice. It prevents heat accumulation from damaging the display device.The heat dissipation layer 50 can be a composite film layer composed ofa composite adhesive layer, a metal copper layer, a polyimide layer, anda foam layer.

The display panel 10 includes a first area 110 and a bonding area 102connected to the first area 110, and the first area 110 includes alight-transmitting area 101. The first area 110 may be an area with adisplay function in the display panel 10. Compared with other areas onthe display panel 10, the light-transmitting area 101 has higher lighttransmittance to meet the lighting requirements of the opticalcomponents disposed on the lower side of the light-transmitting area101. The bonding area 102 may not have a display function, and a varietyof wiring lines are provided inside. The chip IC or flexible circuitboard is bonded to the display panel 10 through the bonding area 102,used to provide a driving signal or a control signal for the displaypanel 10. The method of bonding the chip IC or flexible circuit board tothe display panel 10 is the hot-pressing method. The bonding area 102can be bent to a backside of the display panel 10 through a bending areato realize the narrow frame design of the display device. The heatdissipation layer 50 includes a third opening corresponding to thelight-transmitting area 101.

The support layer 20 is disposed on the backside of the display panel oran opposite side of the light-emitting surface of the display panel 10.The support layer 20 includes a first support layer 21, a second supportlayer 22, and a third support layer 23. The first support layer 21 isdisposed corresponding to the first area 110 and the bonding area 102,and the second support layer 22 is disposed on the lower side of thefirst support layer 21 corresponding to the bonding area 102. The thirdsupport layer 23 is disposed on the lower side of the first supportlayer 21 corresponding to the first area 110, and the third supportlayer 23 is provided with a second opening 203 at a positioncorresponding to the light-transmitting area 101. An optical phase delaycoefficient of the first support layer 21 is less than an optical phasedelay coefficient of the second support layer 22.

Alternatively, the first support layer 21 may be disposed onlycorresponding to the first area 110 or only the light-transmitting area101, and the second support layer 22 may be directly disposed on thelower side of the bonding area.

It should be noted that the first support layer 21 has lighttransmittance in at least an area corresponding to thelight-transmitting area 101. In this embodiment, by adjusting theoptical phase delay coefficient of the first support layer 21, theoptical phase delay coefficient of the first support layer 21 is lessthan that of the second support layer 22, so as to reduce or eliminatethe phase retardation effect of the first support layer 21 on the light.It prevents the light passing through the light-transmitting area 101from forming bright and dark stripes. It is beneficial to improve thelighting effect of the optical components disposed corresponding to thelight-transmitting area 101.

Alternatively, an optical phase retardation coefficient of the firstsupport layer 21 is less than or equal to 100, and an optical phaseretardation coefficient of the second support layer 22 is greater than100. It should be noted that through multiple creative experiments andcreative calculations on the basis of the experiments, it is proven thatwhen the light phase retardation coefficient of the first support layer21 is set to be less than or equal to 100, the phase retardation effecton the light will not cause the emitted light to form bright and darkstripes, or have a significant impact on the lighting effect of theoptical components under the screen.

Alternatively, the first support layer 21 may be made of materials witha low phase retardation coefficient such as cyclic olefin polymer (COP),tri-cellulose acetate (TAC), colorless polyimide (CPI), or poly (methylmethacrylate) (PMMA).

Further, the thermal expansion coefficient of the second support layer22 is less than the thermal expansion coefficient of the first supportlayer 21. It should be noted that the second support layer 22corresponds to the bonding area 102 of the display panel 10, and becausethe process of bonding the chip IC or flexible circuit board to thebonding area 102 requires adopting a hot-pressing method, the supportlayer that supports the bonding area 102 needs to have good heatresistance. In this embodiment, the thermal expansion coefficient of thesecond support layer 22 is adjusted so that the thermal expansioncoefficient of the support layer 22 is less than the thermal expansioncoefficient of the first support layer 21. By controlling the expansionamount of the second support layer 22 under the condition of hotpressing, it prevents the chip IC or flexible circuit board from beingpoorly bonded to the display panel 10 due to excessive expansion of thesupport layer. It is beneficial to improve the manufacturing yield andreliability of the display device.

Alternatively, the second support layer 22 and the third support layer23 may be made of materials with a low phase retardation coefficientsuch as polyethylene terephthalate (PET).

Further, please refer to FIG. 9 and FIG. 10 . FIG. 10 is a schematicdiagram of the structure of the support layer in the display deviceshown in FIG. 9 during the manufacturing process. Before the supportlayer 20 is attached to the display panel 10, a release film C1 and acarrier film C2 are attached to both sides of the support layer 20,respectively. In this embodiment, the method of manufacturing thesupport layer 20 includes following steps: taking a first raw materialincluding a first splicing layer L1 and a second raw material includinga second splicing layer L2; removing the carrier film C2 of the firstraw material and the release film C1 of the second raw material;attaching the second splicing layer L2 to the lower side of the firstsplicing layer L1; using a die-cut mold to perform a first half-cuttingalong a cutting line B1 of the carrier film C2 side until reaching abonding surface of the release film C1 and the first splicing layer L1,and using a die-cut mold to perform a second half-cutting along acutting line B2 until reaching to a bonding surface of the secondsplicing layer L2 and the first splicing layer L1; removing the cutcarrier film C2, and attaching the complete carrier film C2 thereto;removing the release film C1, and attaching the first splicing layer L1and the second splicing layer L2 integrally to the backside of thedisplay panel 10 according to the positions shown in the embodiment ofFIG. 9 ; removing the carrier film C2, and the manufacturing of thesupport layer 20 is completed.

In one embodiment, please refer to FIG. 11 . FIG. 11 is a schematicdiagram of a sixth structure of a display device provided in anembodiment of the present application. The display device includes adisplay panel 10, and the display panel 10 includes a first area 110, abending area 103, and a bonding area 102. The bending area 103 isconnected between the first area 110 and the bonding area 102 so thatthe first area 110 and the bonding area 102 are arranged oppositely. Thefirst area 110 has a light-transmitting area 101 therein. The first area110 has a display function, and the bonding area 102 and the bendingarea 103 may not have a display function. A variety of wiring lines areprovided inside the bonding area 102. The chip IC and the flexiblecircuit board FCP are bonded to the display panel 10 through the bondingarea 102, and are used to provide a driving signal or a control signalfor the display panel 10. An organic layer 70 is disposed on the outerside of the bending area 103. The organic layer 70 has an insulating andprotective effect on the bending area 103.

The display device further includes a support layer 20 disposed on thenon-light emitting surface of the display panel 10. The support layer 20includes a first support layer 21 corresponding to the first area 110and a second support layer 22 corresponding to the bonding area 102. Thefirst support layer 21 includes a first portion 211 corresponding to thelight-transmitting area 101, and the first portion 211 may be part orall of the first support layer 21. The second support layer 22 includesa second portion corresponding to the bonding area 102, and the secondportion may be part or all of the second support layer 22. An opticalphase retardation coefficient of the first portion 211 is less than anoptical phase retardation coefficient of the second portion. In thisembodiment, by adjusting the optical phase delay coefficient of thefirst portion 211, the optical phase delay coefficient of the firstportion 211 is less than that of the second portion, or the opticalphase retardation coefficient of the first portion 211 is less than theoptical retardation coefficient of other areas of the support layer 20except the first portion 211, so as to reduce or eliminate the phaseretardation effect of the support layer on the light. It is beneficialto improve the lighting effect of the optical components disposedcorresponding to the light-transmitting area 101.

The display device further includes a polarizer layer 30 disposed on thefirst area 110 and a cover plate layer 40 disposed on the polarizerlayer 30. The polarizer layer 30 has a polarization effect and is usedto adjust the visual effect of the display panel 10, and the polarizerlayer 30 may be a monolithic polarizer. The cover plate layer 40 is usedto encapsulate and protect various components in the display device toprevent damage from external forces or corrosion by external watervapor, etc., and the cover plate layer 40 may be a glass cover plate.

The display device further includes a heat dissipation layer 50 disposedon the lower side of the support layer 20, and the heat dissipationlayer 50 includes a third opening corresponding to thelight-transmitting area 101. The bending area 103 is connected to theheat dissipation layer 50 through the second support layer 22 and asupport pad 60. The heat dissipation layer 50 is used to conduct anddissipate the heat in the display device. It prevents heat accumulationfrom damaging the display device. The heat dissipation layer 50 may be acomposite film layer composed of a composite adhesive layer, a metalcopper layer, a polyimide layer, and a foam layer. Alternatively, anoptical phase retardation coefficient of the first portion 211 is lessthan or equal to 100, and the optical phase retardation coefficient ofthe second portion is greater than 100. The first portion 211 may bemade of materials with a low phase retardation coefficient such ascyclic olefin polymer (COP), tri-cellulose acetate (TAC), colorlesspolyimide (CPI), or poly (methyl methacrylate) (PMMA). Alternatively,the thermal expansion coefficient of the second portion is less than thethermal expansion coefficient of the first portion 211. The secondportion may be made of materials with a relatively low thermal expansioncoefficient such as polyethylene terephthalate (PET).

Further, please refer to FIG. 12 . The display device further includesan optical component 70 and a frame 80. The optical component 70 isfixed on the side of the non-light emitting surface of the display panel10 by the frame 80, and the position of the optical component 70corresponds to the position of the light-transmitting area 101. Theoptical component 70 can collect external light through thelight-transmitting area 101 to perform its function.

As mentioned above, the display device provided by the embodiments ofthe present application includes a display panel and a support layer.The display panel has a light-transmitting area and a bonding areaconnected to the light-transmitting area. The support layer includes afirst support layer and a second support layer, where the first supportlayer has a first portion corresponding to the light-transmitting area,the second support layer has a second portion corresponding to thebonding area. By configuring an optical phase retardation coefficient ofthe first portion to be less than an optical phase retardationcoefficient of the second portion, the phase retardation effect of thesupport layer on the light passing through the light-transmitting areais alleviated or eliminated, which prevents light and dark stripes fromappearing in the light-transmitting area, and improves the lightingeffect of optical components under the screen. In addition, the supportlayer corresponding to the bonding area of the display panel has asmaller thermal expansion coefficient, which prevents a bonding failuredue to an excessive expansion and contraction of the support layerduring a bonding process, and improves the manufacturing yield and thereliability of the display device.

It should be noted that although this application is disclosed inspecific embodiments, the embodiments are not intended to limit thisapplication. Those of ordinary skill in the art can make various changesand modifications without departing from the spirit and scope of thisapplication. Therefore, the protection scope of this application issubject to the scope defined by the claims.

What is claimed is:
 1. A display device, comprising: a display panelcomprising a light-transmitting area and a bonding area connected to thelight-transmitting area; and a support layer disposed on a backside ofthe display panel, wherein the support layer comprises a first supportlayer and a second support layer, the first support layer comprises afirst portion corresponding to the light-transmitting area, the secondsupport layer comprises a second portion corresponding to the bondingarea, and an optical phase retardation coefficient of the first portionis less than an optical phase retardation coefficient of the secondportion.
 2. The display device according to claim 1, wherein a thermalexpansion coefficient of the second portion is less than a thermalexpansion coefficient of the first portion.
 3. The display deviceaccording to claim 1, wherein the optical phase retardation coefficientof the first portion is less than or equal to
 100. 4. The display deviceaccording to claim 1, wherein a material of the first portion comprisesat least one of cycloolefin polymer, triacetyl cellulose, colorlesspolyimide, or poly (methyl methacrylate).
 5. The display deviceaccording to claim 1, wherein a material of the second portion comprisespolyethylene terephthalate.
 6. The display device according to claim 1,wherein the display panel comprises a first area, the first areacomprises the light-transmitting area, and the bonding area is connectedto the first area.
 7. The display device according to claim 6, whereinthe first support layer is disposed corresponding to the first area, andthe first portion is an entire region of the first support layer.
 8. Thedisplay device according to claim 6, wherein an area of the firstportion is greater than an area of the light-transmitting area.
 9. Thedisplay device according to claim 6, wherein the second portion is anentire region of the second support layer.
 10. The display deviceaccording to claim 6, wherein the display panel further comprises abending area connected between the first area and the bonding area, andthe first area is disposed opposite to the bonding area.
 11. The displaydevice according to claim 6, wherein the support layer further comprisesa third support layer disposed corresponding to the first area, thethird support layer is provided with a first opening, and the firstsupport layer is disposed in the first opening.
 12. The display deviceaccording to claim 11, wherein a material of the second support layerand a material of the third support layer both comprise polyethyleneterephthalate.
 13. The display device according to claim 6, wherein thesupport layer further comprises a third support layer disposedcorresponding to the first area, the third support layer is located on alower side of the first support layer, the third support layer isprovided with a second opening, and the second opening is providedcorresponding to the light-transmitting area.
 14. The display deviceaccording to claim 6, wherein the first support layer is disposedcorresponding to the first area, and the second support layer isdisposed corresponding to the bonding area.
 15. The display deviceaccording to claim 6, wherein the first support layer is disposedcorresponding to the first area and the bonding area, the second supportlayer is disposed corresponding to the bonding area, and the secondsupport layer is located on a side of the first support layer away fromthe display panel.
 16. The display device according to claim 1, furthercomprising an anti-reflective film on one side of the support layer,wherein the anti-reflective film is disposed corresponding to thelight-transmitting area.
 17. The display device according to claim 16,wherein a material of the anti-reflective film comprises asubmicron-level transparent ceramic material.
 18. The display deviceaccording to claim 1, further comprising a polarizing layer disposed onthe display panel, a cover plate layer disposed on the polarizing layer,and a heat dissipation layer disposed on a backside of the supportlayer, wherein the heat dissipation layer is provided with a thirdopening corresponding to the light-transmitting area.
 19. The displaydevice according to claim 1, further comprising an optical component,and the optical component is disposed corresponding to thelight-transmitting area.
 20. A display device, comprising: a displaypanel comprising a first area, a bending area connected to the firstarea, and a bonding area connected to the bending area, wherein thefirst area comprises a light-transmitting area; and a support layerdisposed on a backside of the display panel, wherein the support layercomprises a first support layer, a second support layer, and a thirdsupport layer, the first support layer is disposed corresponding to thefirst area and the bonding area, the second support layer is disposedcorresponding to the bonding area, and the second support layer islocated on a side of the first support layer away from the displaypanel, the third support layer is disposed corresponding to the firstarea, and the third support layer is located on the side of the firstsupport layer away from the display panel, the third support layer isprovided with an opening corresponding to a position of thelight-transmitting area, and an optical phase retardation coefficient ofthe first support layer is less than an optical phase retardationcoefficient of the second support layer.